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Part:BBa_K539521:Design

Designed by: Shu-Han Chang   Group: iGEM11_NCTU_Formosa   (2011-09-27)
Revision as of 17:03, 27 September 2011 by Zcc (Talk | contribs) (→‎Source)

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heat sensitive cI QPI with high promoter and a RBS


Assembly Compatibility:
  • 10
    COMPATIBLE WITH RFC[10]
  • 12
    INCOMPATIBLE WITH RFC[12]
    Illegal NheI site found at 7
    Illegal NheI site found at 30
  • 21
    COMPATIBLE WITH RFC[21]
  • 23
    COMPATIBLE WITH RFC[23]
  • 25
    COMPATIBLE WITH RFC[25]
  • 1000
    COMPATIBLE WITH RFC[1000]


Design Notes

Built in constitutive expressing promoter followed by RBS, CI, PCI (Part:BBa_K098995) and strong expressing RBS(Part:BBa_B0034).

Source

The divice (Part:BBa_K098995) which can be used to construct a heat-inducible system is from 2008 iGEM Harvard.

References