Difference between revisions of "Part:BBa K817013"
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<partinfo>BBa_K817013 short</partinfo> | <partinfo>BBa_K817013 short</partinfo> | ||
− | As we sought to design a thermal sensitive composite part, we integrate our modified pCI promoter with temperature sensitive CI repressor, which is cloned from Harvard’s thermal regulation part, 2008. (BBa_K098988). We showed the modified promoter design had superior repression effects. | + | As we sought to design a thermal sensitive composite part, we integrate our modified pCI promoter(modification of pCI, BBa_R0051) with temperature sensitive CI repressor, which is cloned from Harvard’s thermal regulation part, 2008. (BBa_K098988). We showed the modified promoter design had superior repression effects. |
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Revision as of 12:01, 5 October 2012
pCI(OR1-OL1)-mRFP
As we sought to design a thermal sensitive composite part, we integrate our modified pCI promoter(modification of pCI, BBa_R0051) with temperature sensitive CI repressor, which is cloned from Harvard’s thermal regulation part, 2008. (BBa_K098988). We showed the modified promoter design had superior repression effects.
Sequence and Features
Assembly Compatibility:
- 10COMPATIBLE WITH RFC[10]
- 12COMPATIBLE WITH RFC[12]
- 21COMPATIBLE WITH RFC[21]
- 23COMPATIBLE WITH RFC[23]
- 25INCOMPATIBLE WITH RFC[25]Illegal AgeI site found at 625
Illegal AgeI site found at 737 - 1000COMPATIBLE WITH RFC[1000]